Bengaluru fabless startup Sensesemi raises Rs 25 crore seed round to build edge-AI chips
Sensesemi Technologies, a Bengaluru-based fabless semiconductor startup, has raised Rs 25 crore in seed funding to develop low-power edge-AI system-on-chips combining AI inferencing, wireless connectivity and analogue signal processing.
- Reporting desk
- Health India Network News Desk
- First published
Bengaluru-based fabless semiconductor startup Sensesemi Technologies has raised Rs 25 crore (about $2.75 million) in a seed funding round to build integrated edge-AI chips, as investors continue to back India’s deep-tech and semiconductor ambition.
Reports said the round was led by Piper Serica, with participation from LetsVenture Angel Fund, Sun Icon Ventures, MyAsiaVC, White Pine Investments and Jain Oncor, alongside several angel investors. The company is working on system-on-chips (SoCs) aimed at pushing intelligence closer to sensors—devices that often operate on tight power budgets and are deployed at scale across industrial and consumer environments.
Sensesemi’s product approach centres on integrating AI inferencing, wireless mesh connectivity and analogue signal processing onto a single low-power chip, targeting use cases in healthcare devices, automotive systems, robotics and industrial IoT. The company’s pitch is that adding on-device intelligence at the sensor node can reduce latency, lower bandwidth needs and enable smarter automation without always depending on cloud processing.
The founders said they are planning a first chip tape-out in the near term, with commercial production targeted for next year, and a second test chip planned later in the year. The company also expects to work with global fabrication partners for the first generation of chips, while exploring testing and packaging options including domestic OSAT players—an area that has historically been a bottleneck for Indian fabless efforts.
The funding comes amid broader momentum for semiconductor capability-building in India, as policymakers and industry push for more local design, testing and packaging capacity. For early-stage fabless startups, proving performance at ultra-low power, securing repeatable manufacturing workflows, and building partnerships with device makers are often as critical as the chip architecture itself.
- What the startup is building: edge-AI SoCs that combine AI + wireless + analogue sensing blocks.
- Why it matters: more intelligence at the sensor can cut latency and reduce cloud dependence.
- Near-term milestone: tape-out and early prototypes, followed by production ramp and customer pilots.